Tech Company Financing Transactions
3DEO Funding Round
On 1/19/2024, 3DEO received funding from Development Bank of Japan and Seiko Epson.
Transaction Overview
Company Name
Announced On
1/19/2024
Transaction Type
Venture Equity
Amount
Unknown
Round
Undisclosed
Investors
Proceeds Purpose
The company intends to use the investment to accelerate its growth strategies in North America and Japan, expanding opportunities for partnership in the semiconductor, aerospace, medical devices and equipment, and industrial sectors.
Company Information
Company Status
Private & Independent
Industry
Manufacturing
Mailing Address
24225 Garnier Street
Torrance, CA 90505
USA
Torrance, CA 90505
USA
Phone
Website
Email Address
Overview
3DEO is an award-winning design, engineering and manufacturing service specializing in complex metal 3D printed components. Our expertise in Design for Additive Manufacturing (DfAM) facilitates a seamless transition into scalable production.
Management Team
Title
Name
Email & Social
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