Tech Company Financing Transactions
Mantle Funding Round
On 7/10/2024, Mantle raised $20 million in Series C financing from Schooner Capital, 11.2 Capital and Build Collective.
Transaction Overview
Company Name
Announced On
7/10/2024
Transaction Type
Venture Equity
Amount
$20,000,000
Round
Series C
Investors
Proceeds Purpose
The company intends to use the funds to expand operations and its development efforts.
Company Information
Company Status
Private & Independent
Industry
Software
Mailing Address
1950 Cesar Chavez Street
San Francisco, CA 94124
USA
San Francisco, CA 94124
USA
Phone
Website
Email Address
Overview
For years, the reality of 3D metal printing has lagged behind the promise of cost-effective part manufacturing. Existing metal printing technologies were expensive and produced casting-quality parts that were a far cry from the surface finish and tolerances needed in many applications. A new approach was needed. After successfully developing a new printable electronics material for the solar industry, Stephen Connor wondered if a similar material could be layered to produce solid metal parts. He joined forces with Silicon Valley serial entrepreneur Ted Sorom to form Mantle.
Management Team
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