Tech Company Financing Transactions
Inpria Funding Round
Samsung Ventures, Applied Ventures and Intel Capital participated in a $23.5 million Series B funding round for Inpria. The round was announced on 7/11/2017.
Transaction Overview
Company Name
Announced On
7/11/2017
Transaction Type
Venture Equity
Amount
$23,500,000
Round
Series B
Investors
Samsung Ventures (Lead Investor) (Dong-Su Kim)
Intel Capital (Wendell Brooks)
Proceeds Purpose
Fueled by growing customer demand, Inpria will use the funds to complete its pilot manufacturing facility and to commence commercial production.
Company Information
Company Status
Private & Independent
Industry
Advanced Materials
Mailing Address
1100 NE Circle Blvd. 360
Corvallis, OR 97330
USA
Corvallis, OR 97330
USA
Phone
Website
Email Address
Overview
Inpria Corporation extends semiconductor lithography with inorganic photoresists and other thin films for nanoscale patterning.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Andrew Grenville
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About Database of VC Transactions
Our team works diligently to report on tech company VC transactions. VC investment data records on this site are sourced from a variety of public sources. The data is sourced from VentureDeal.com, an affiliated venture.
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