Tech Company Financing Transactions
BondLink Funding Round
Franklin Templeton and Coatue Management participated in a $10 million Series A venture round for BondLink. The financing was announced by the company on 1/5/2018.
Transaction Overview
Company Name
Announced On
1/5/2018
Transaction Type
Venture Equity
Amount
$10,000,000
Round
Series A
Investors
Franklin Templeton (Lead Investor) (Jennifer Johnston)
Proceeds Purpose
BondLink intends to use the funds to accelerate and expand adoption of its software to the roughly 50,000 public sector bond issuers across the United States.
Company Information
Company Status
Private & Independent
Industry
FinTech
GovTech
GovTech
Mailing Address
330 Congress St. 5th Floor
Boston, MA 02210
USA
Boston, MA 02210
USA
Phone
Website
Email Address
Overview
BondLink is an investor relations and disclosure platform for municipal bond issuers, facilitating regulatory compliance and communication with investors. The idea to create a technology company to exclusively serve the needs of municipal issuers was developed over founder Colin MacNaught's time working as debt manager for the Commonwealth of Massachusetts.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Colin MacNaught
Chief Technical Officer
Carl Query
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