Tech Company Financing Transactions
NexPlanar Funding Round
Private investors participated in a $10 million funding round for NexPlanar. The financing round was announced on 1/4/2013.
Transaction Overview
Company Name
Announced On
1/4/2013
Transaction Type
Venture Equity
Amount
$10,000,000
Round
Undisclosed
Investors
Proceeds Purpose
Proceeds purposes were not disclosed. SEC regulatory filing.
Company Information
Company Status
Acquired or Merged
Industry
Semiconductors
Mailing Address
7175 NW Evergreen Parkway 200
Hillsboro, OR 97124
USA
Hillsboro, OR 97124
USA
Phone
Website
Email Address
Overview
NexPlanar builds the next generation of chemical mechanical planarization (CMP) pads for the semiconductor device industry. Our propriety nano-domain technology coupled with patented molded grooves and the unique ability to tune the pads results in dramatically improved yields and lower cost of ownership with extended pad life.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
James LaCasse
Chief Financial Officer
David Davies
VP - Engineering
Robert Kerprich
VP - Operations
Don Schoeppner
VP - Sales
Scott Hirst
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Next: 1/4/2013: UpdateLogic venture capital transaction
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Where The Data Comes From
Our team works diligently to document funding rounds that are announced publicly. VC investment data records reported here are sourced from news reports and company announcements. The data is sourced from VentureDeal.com, an affiliated venture.
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