Tech Company Financing Transactions
Thintronics Funding Round
On 4/29/2024, Thintronics raised $23 million in Series A funding from Maverick Capital, Translink Capital and private investors.
Transaction Overview
Company Name
Announced On
4/29/2024
Transaction Type
Venture Equity
Amount
$23,000,000
Round
Series A
Investors
Maverick Capital (Lead Investor)
Translink Capital (Lead Investor)
Proceeds Purpose
The company intends to use the funds to support commercialization of a novel insulator platform.
Company Information
Company Status
Private & Independent
Industry
Electronics
Mailing Address
2332 Fourth Street, Studio G
Berkeley, CA 94710
USA
Berkeley, CA 94710
USA
Phone
Undisclosed
Website
Email Address
Overview
Data demand has increased steadily over the last decade. AI integration has seen that demand grow exponentially. Thintronics optimizes Interconnect Insulation enabling the highest data rates at the lowest power consumption. Next generation technology requires electronics to do more in less space at higher data rates and with the lowest power consumption.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Stefan Pastine
Chief Technical Officer
Tristan El Bouyadi
VP - Engineering
Luc Beauviller
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