Tech Company Financing Transactions
Inpria Funding Round
Samsung Ventures, Applied Ventures and Intel Capital participated in a $4.7 million funding round for Inpria. The round was announced on 2/21/2014.
Transaction Overview
Company Name
Announced On
2/21/2014
Transaction Type
Venture Equity
Amount
$4,700,000
Round
Undisclosed
Investors
Proceeds Purpose
The company intends to use the funds to expand the team and accelerate product development.
Company Information
Company Status
Private & Independent
Industry
Advanced Materials
Mailing Address
1100 NE Circle Blvd. 360
Corvallis, OR 97330
USA
Corvallis, OR 97330
USA
Phone
Website
Email Address
Overview
Inpria Corporation extends semiconductor lithography with inorganic photoresists and other thin films for nanoscale patterning.
Management Team
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About Database of VC Transactions
Our team works diligently to report on tech company VC transactions. VC investment data records on this site are sourced from a variety of public sources. The data is sourced from VentureDeal.com, an affiliated venture.
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