Tech Company Financing Transactions
Honor Device Funding Round
CICC Capital, Cornerstone Venture Partners and private investors participated in a funding round for Honor Device. The round was announced on 10/31/2024.
Transaction Overview
Company Name
Announced On
10/31/2024
Transaction Type
Amount
Unknown
Round
Undisclosed
Investors
Proceeds Purpose
Proceeds purposes were not disclosed.
Company Information
Company Status
Private & Independent
Industry
Mobile
Mailing Address
Unit A, Building 6, Shenye Zhongcheng, No. 8089, Hongli West 3401
Shenzhen, Guangdong, 518040
China
Shenzhen, Guangdong, 518040
China
Phone
Undisclosed
Website
Email Address
Not Recorded
Overview
HONOR is a leading global provider of smart devices. We are committed to becoming a global iconic tech brand and enabling a smart life across all scenarios and all channels, for all people. With a strategic focus on innovation, quality and service, HONOR is dedicated to developing technology that empowers people around the globe to go beyond through its R&D capabilities and forward-looking technology, as well as creating a new intelligent world for everyone with its portfolio of innovative products.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
George Zhao
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