Tech Company Financing Transactions
1366 Technologies Funding Round
1366 Technologies closed a $6 million Series B venture capital round on 12/16/2010. Investors included private investors.
Transaction Overview
Company Name
Announced On
12/16/2010
Transaction Type
Venture Equity
Amount
$6,000,000
Round
Series B
Investors
Proceeds Purpose
The new round will enable 1366 to take its revolutionary Direct Wafer technology into production, a milestone the company will achieve well in advance of its original plan.
Company Information
Company Status
Private & Independent
Industry
Alternative Energy
Mailing Address
6 Preston Ct.
Bedford, MA 01730
USA
Bedford, MA 01730
USA
Phone
Website
Email Address
Overview
Solving Silicon PV's Cost Barrier -- Silicon PV wafers comprise 50% of the cost of a module and limit manufacturers' cell efficiencies due to bulk quality and surface non-uniformities. 1366's one-step Direct Wafer process solves these quality and cost barriers by providing manufacturers with a uniformly better wafer produced for a fraction of the cost.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Frank Van Mierlo
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