Tech Company Financing Transactions

Overbond Funding Round

Overbond closed a $7.5 million Seed investment round on 6/17/2016. Investors included Morrison Financial Services Limited.

Transaction Overview

Company Name
Announced On
6/17/2016
Transaction Type
Venture Equity
Amount
$7,500,000
Round
Seed
Investors
Proceeds Purpose
Overbond plans to use the financing to expand its fully-digital primary bond issuance platform.

Company Information

Company Status
Private & Independent
Industry
Internet & IoT
Mailing Address
335 Madison Ave. 16th Floor
New York, NY 10017
USA
Email Address
Overview
Overbond is the first fintech platform for digital bond issuance.
Profile
Overbond LinkedIn Company Profile
Social Media
Overbond Company Twitter Account
Company News
Overbond News
Facebook
Overbond on Facebook
YouTube
Overbond on YouTube

Management Team

Title
Name
Email & Social
Chief Executive Officer
Vuk Magdelinic
  Vuk Magdelinic LinkedIn Profile  Vuk Magdelinic Twitter Account  Vuk Magdelinic News  Vuk Magdelinic on Facebook


 

 

Browse more venture capital transactions:

Prev: 6/17/2016: StockTwits venture capital transaction
Next: 6/17/2016: Collective venture capital transaction

 

Share this article

 


About Our Venture Capital Transactions Database

Our team works diligently to document all VC transactions involving tech companies. VC investment data records reported here are sourced from company press releases and news coverage. The data comes to us via our partnership with VentureDeal.com, an affiliated venture.

 


Additional Resources for Entrepreneurs

Lists of Venture Capital and Private Equity Firms

Franchise Opportunities

Contributors

Business Glossary