Tech Company Financing Transactions
1366 Technologies Funding Round
1366 Technologies closed a $18 million Series E funding round on 12/18/2019. Investors included Breakthrough Energy Ventures.
Transaction Overview
Company Name
Announced On
12/18/2019
Transaction Type
Venture Equity
Amount
$18,000,000
Round
Series E
Investors
Proceeds Purpose
Proceeds purposes were not disclosed.
Company Information
Company Status
Private & Independent
Industry
Alternative Energy
Mailing Address
6 Preston Ct.
Bedford, MA 01730
USA
Bedford, MA 01730
USA
Phone
Website
Email Address
Overview
Solving Silicon PV's Cost Barrier -- Silicon PV wafers comprise 50% of the cost of a module and limit manufacturers' cell efficiencies due to bulk quality and surface non-uniformities. 1366's one-step Direct Wafer process solves these quality and cost barriers by providing manufacturers with a uniformly better wafer produced for a fraction of the cost.
Management Team
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