Tech Company Financing Transactions
Parlay Funding Round
On 2/14/2024, Parlay raised $1.3 million in Seed funding from Fenway Summer Ventures, Alumni Ventures and Hivers and Strivers.
Transaction Overview
Company Name
Announced On
2/14/2024
Transaction Type
Venture Equity
Amount
$1,300,000
Round
Seed
Investors
Proceeds Purpose
This pre-seed funding enables us to continue fulfilling our mission: partnering with community banks and credit unions to extend more loans to the small businesses that form the backbone of our economy.
Company Information
Company Status
Private & Independent
Industry
FinTech
Mailing Address
Undisclosed
Alexandria, VA Undisclosed
USA
Alexandria, VA Undisclosed
USA
Phone
Undisclosed
Website
Email Address
Not Recorded
Overview
Parlay is an embedded fintech that helps community banks and credit unions get more small businesses approved for loans. Parlay is proud to partner with a network of trusted financial institutions, CDFIs, ecosystem partners, and capital providers. Parlay improves the application process for borrowers and delivers unique borrower insights to financial institutions.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Alexandra McLeod
Chief Operating Officer
Jay Long
Chief Technical Officer
James Cho
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