Tech Company Financing Transactions
Viaduct Funding Round
Viaduct secured a $10 million Series B funding round on 6/4/2024. Investors included FM Capital, EXOR and Innovation Endeavors.
Transaction Overview
Company Name
Announced On
6/4/2024
Transaction Type
Venture Equity
Amount
$10,000,000
Round
Series B
Investors
Proceeds Purpose
The company will use the proceeds to accelerate both business development and deployments for its solution that helps customers improve product quality, boost customer satisfaction and drive operational efficiency.
Company Information
Company Status
Private & Independent
Industry
Transportation
Mailing Address
1010 Doyle St. 200
Menlo Park, CA 94025
USA
Menlo Park, CA 94025
USA
Phone
Undisclosed
Website
Email Address
Overview
At Viaduct, we are laser-focused on developing end-to-end machine learning and data analytics platform to empower OEMs to manage, analyze, and utilize their connected vehicle data. Our platform transforms this data into actionable insights for these OEMs, their partners, and their end-customers.
Management Team
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Where The Data Comes From
We record tech company VC transactions. All VC database entries reported here are derived from news reports and company announcements. The information is sourced from VentureDeal.com, an affiliated venture.
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