Tech Company Financing Transactions

Stablcor Technology Funding Round

Dow Venture Capital participated in a $1.7 million funding round for Stablcor Technology. The round was recorded on 6/30/2013.

Transaction Overview

Announced On
6/30/2013
Transaction Type
Venture Equity
Amount
$1,667,000
Round
Undisclosed
Proceeds Purpose
Proceeds purposes were not disclosed.

Company Information

Company Status
Private & Independent
Industry
Semiconductors
Mailing Address
17011 Beach Blvd. 900
Huntington Beach, CA 92647
USA
Email Address
Overview
STABLCOR TECHNOLOGY, INC. is an Intellectual Property Company solving thermal and mechanical problems in Printed Circuit Boards and IC Substrates. Our patented STABLCOR product, (a carbon composite laminate), when embedded into a PCB allows electronics to pass beyond the thermo-mechanical limitations of today's current materials and technologies.
Profile
Stablcor Technology LinkedIn Company Profile
Social Media
Stablcor Technology Company Twitter Account
Company News
Stablcor Technology News
Facebook
Stablcor Technology on Facebook
YouTube
Stablcor Technology on YouTube

Management Team

Title
Name
Email & Social
Chief Executive Officer
Doug Schneider
  Doug Schneider LinkedIn Profile  Doug Schneider Twitter Account  Doug Schneider News  Doug Schneider on Facebook
VP - Sales
Don Roy
  Don Roy LinkedIn Profile  Don Roy Twitter Account  Don Roy News  Don Roy on Facebook


 

 

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About Our VC Transactions Data

We do our best to report on every notable VC transaction. VC investment data records on this site are derived from news reports and company announcements. The information is sourced from VentureDeal.com, an affiliated venture.

 


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