Tech Company Financing Transactions
Akustica Funding Round
Akustica closed a $2.5 million funding round on 9/30/2008. Investors included Mobius Venture Capital.
Transaction Overview
Company Name
Announced On
9/30/2008
Transaction Type
Venture Equity
Amount
$2,500,000
Round
Undisclosed
Investors
Mobius Venture Capital (Ryan McIntyre)
Proceeds Purpose
Proceeds purposes were not disclosed.
Company Information
Company Status
Acquired or Merged
Industry
Semiconductors
Mailing Address
2835 East Carson St. 301
Pittsburgh, PA 15203
USA
Pittsburgh, PA 15203
USA
Phone
Website
Email Address
Overview
Akustica's Sensory Silicon products are a family of complete digital, analog and mechanical systems that can hear, speak, and sense the world around them. Sensory Silicon devices are designed and manufactured using our revolutionary CMOS MEMS technology which is superior to other MEMS technologies in both device performance and manufacturability.
Management Team
Title
Name
Email & Social
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