Tech Company Financing Transactions
Postprocess Technologies Funding Round
Postprocess Technologies closed a $1 million Seed funding round on 4/27/2017. Investors included New York Ventures.
Transaction Overview
Company Name
Announced On
4/27/2017
Transaction Type
Venture Equity
Amount
$1,000,000
Round
Seed
Investors
Proceeds Purpose
PostProcess Technologies will use the funding to further accelerate technology developments (including proprietary software, hardware and chemistry) and expand its global Customer Experience Team to meet an exponential growth in demand.
Company Information
Company Status
Private & Independent
Industry
Manufacturing
Mailing Address
2495 Main St. 615
Buffalo, NY 14214
USA
Buffalo, NY 14214
USA
Phone
Website
Email Address
Overview
At PostProcess Technologies, our proprietary software along with our patent-pending machines and consumables remove the bottleneck in the third step of additive manufacturing--post-printing. We make the process of removing supports and surface finishing the printed parts easier, more consistent and more efficient.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Jeffrey Mize
Chief Technical Officer
Daniel Hutchinson
VP - Bus. Development
Dean VonBank
VP - Finance
Robert Fraass
VP - General Counsel
Frank Kozak
VP - Marketing
Diana Robbins
VP - Operations
Robert Bosinski
VP - Product Management
Richard Caplow
VP - Sales
Nathan Harris
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