Tech Company Financing Transactions
Conduit Funding Round
Conduit closed a $6 million Seed funding round on 8/12/2024. Investors included Helios Digital Ventures.
Transaction Overview
Company Name
Announced On
8/12/2024
Transaction Type
Venture Equity
Amount
$6,000,000
Round
Seed
Investors
Proceeds Purpose
The company intends to use the funds to continue its global expansion across Latin America and Africa.
Company Information
Company Status
Private & Independent
Industry
FinTech
Mailing Address
1001 S Main Street 4080
Kalispell, MT 59901
USA
Kalispell, MT 59901
USA
Phone
Undisclosed
Website
Email Address
Not Recorded
Overview
The Conduit team brings decades of experience in building fintech companies. Seeing firsthand the opportunities and hurdles businesses face when bridging across these ecosystems, Conduit aims to remove the complexity of accessing payments for financial platforms in a scalable way that makes better financial products more accessible to everyone.
Management Team
Title
Name
Email & Social
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