Tech Company Financing Transactions

Due Funding Round

On 11/7/2023, Due secured $3.3 million in Seed funding from Fabric Ventures, Semantic Ventures and BlockTower Capital.

Transaction Overview

Company Name
Announced On
11/7/2023
Transaction Type
Venture Equity
Amount
$3,300,000
Round
Seed
Proceeds Purpose
The company intends to use the funds to further develop its technology and to expand its fiat currency connectivity to more markets.

Company Information

Company Status
Private & Independent
Industry
Blockchain
Mailing Address
Undisclosed
London, England, Undisclosed
UK
Phone
Undisclosed
Email Address
Overview
Open a borderless account from anywhere, send and receive payments worldwide, with instant access to funds in stablecoins or local currency. Seamless and 5-10x cheaper than traditional payment solutions.
Profile
Due LinkedIn Company Profile
Social Media
Due Company Twitter Account
Company News
Due News
Facebook
Due on Facebook
YouTube
Due on YouTube

Management Team

Title
Name
Email & Social
Chief Executive Officer
Robert Sargsian
  Robert Sargsian LinkedIn Profile  Robert Sargsian Twitter Account  Robert Sargsian News  Robert Sargsian on Facebook
Chief Technical Officer
Alex Popov
  Alex Popov LinkedIn Profile  Alex Popov Twitter Account  Alex Popov News  Alex Popov on Facebook


 

 

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Prev: 11/7/2023: Bimaplan venture capital transaction
Next: 11/7/2023: Smalt venture capital transaction

 

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