Tech Company Financing Transactions
Wireless Glue Networks Funding Round
Wireless Glue Networks, operating out of Danville, secured $4.5 million from Clean Pacific Ventures, Hosiden and Innovation Network Corporation of Japan.
Transaction Overview
Company Name
Announced On
2/23/2013
Transaction Type
Venture Equity
Amount
$4,500,000
Round
Series B
Investors
Proceeds Purpose
Proceeds purposes were not disclosed.
Company Information
Company Status
Private & Independent
Industry
Software
Mailing Address
4185 Blackhawk Plaza Cir. 220
Danville, CA 94506
USA
Danville, CA 94506
USA
Phone
Website
Email Address
Overview
Wireless Glue is excited to be a global partner to provide software for the STiNC II gateway platform. We bring the Smart Edge Energy Management Solution (SEEMS) to the STiNC II, and enable it to receive demand response signals and implement device control over a multitude of local networks and devices for building energy management.
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Executive Officer
Peter McCabe
Chief Technical Officer
Matthew Dowling
VP - Engineering
Joseph Hopkins
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