Tech Company Financing Transactions
Polyera Funding Round
Chengwei Ventures, Tsing Capital and private investors participated in a $24.5 million Series C capital raise for Polyera. The funding round was announced on 4/5/2012.
Transaction Overview
Company Name
Announced On
4/5/2012
Transaction Type
Venture Equity
Amount
$24,500,000
Round
Series C
Investors
Chengwei Ventures (Lead Investor)
Tsing Capital (Lead Investor)
Proceeds Purpose
The company plans to use the funds to accelerate development activities while making a major investment in its Asia-Pacific operations in preparation for market launch.
Company Information
Company Status
Private & Independent
Industry
Advanced Materials
Mailing Address
8045 Lamon Ave. 140
Skokie, IL 60077
USA
Skokie, IL 60077
USA
Phone
Website
Email Address
Overview
Polyera Corporation is a leading supplier in semiconductor, dielectric, and interfacial materials for the printed and flexible electronics industry. Polyera is focused on developing breakthrough materials for its portfolio of ActivInk products and on working closely with customers to provide deep technical support
Profile
Social Media
Company News
Facebook
YouTube
Management Team
Title
Name
Email & Social
Chief Scientific Officer
Antonio Facchetti
Founder
Philippe Inagaki
President
Brendan Florez
VP - General Counsel
Karen Chan
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