Tech Company Financing Transactions
Splat Funding Round
On 5/10/2013, Splat landed $18 thousand in Seed investment from Summer@Highland.
Transaction Overview
Company Name
Announced On
5/10/2013
Transaction Type
Accelerator
Amount
$18,000
Round
Seed
Investors
Proceeds Purpose
The company will use the proceeds to accelerate its initial development.
Company Information
Company Status
Out of Business
Industry
Electronics
Mailing Address
206b Dryden Road
Ithaca, NY 14850
USA
Ithaca, NY 14850
USA
Phone
Undisclosed
Website
Email Address
Overview
Splat plugs into your smartphone enabling you to tag and shoot friends while playing Splat Warfare and Splat mini-games, providing a face-to-face gaming experience that is pure fun.
Management Team
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